Summary:
In this episode we discuss China's advancements in semiconductor manufacturing, specifically the development of Localized Dynamic Patterning (LDP) lithography by Huawei and SMIC as a potential alternative to ASML's EUV technology, which China is currently blocked from acquiring due to U.S. sanctions. We explain the significance of EUV for producing advanced sub-5nm chips and how China's LDP breakthrough could help it overcome these restrictions, potentially reshaping the global semiconductor landscape and intensifying competition. We also touch on the geopolitical implications, including potential U.S. responses and the ongoing tech rivalry.
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